You know Steve,
I still have to figure out why the solder is that thin under the pins. Normal 6 mil stencil, good wetting around the pins, fair heel, as seen in the x-section. Pure Sn plating could have an influence on that, like solder going higher on the pin, wicking out from under?
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask]
W | www.digico.cc
N'imprimer que si nécessaire - Print only if you must
-----Message d'origine-----
De : Steve Gregory [mailto:[log in to unmask]]
Envoyé : April-27-10 9:50 AM
À : 'TechNet E-Mail Forum'; Ioan Tempea
Objet : RE: [TN] Failure fatigue photos
Hi Ioan!
That lead style on that connector looks similar to the AMP connector that I
had the "blumpy" plating problem with remember?
They were a kind of stiff butt joint looking thing...
http://stevezeva.homestead.com/files/Connector_Blumpies.jpg
Mine was called a Densipac connector:
http://mouser.com/Search/include/LargeProductImage.aspx?path=tyco/lrg/inhous
e_913937549_t.jpg
I know your datasheet says they were tin/lead plated, but I bet you they
were pure tin.
I don't know if that has anything to do with anything....
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Tuesday, April 27, 2010 9:24 AM
To: [log in to unmask]
Subject: Re: [TN] Failure fatigue photos
Victor,
Zero rework, part is socket
http://www.tycoelectronics.com/catalog/pn/en/5-316365-0?RQPN=5-316365-0 ,
the IMC thickness has not been measured
And thank you Guenter, the lack of compliancy of this component has been
mentioned during design review. I'm so proud of myself...
Best regards,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask]
W | www.digico.cc
N'imprimer que si nécessaire - Print only if you must
-----Message d'origine-----
De : Victor Hernandez [mailto:[log in to unmask]]
Envoyé : April-27-10 9:12 AM
À : [log in to unmask]
Objet : Re: [TN] Failure fatigue photos
What type of component is this and what is the thickness of the IMC layer,
any associated rework on the device.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Tuesday, April 27, 2010 8:00 AM
To: [log in to unmask]
Subject: [TN] Failure fatigue photos
Dear Technos,
It looks like, for the first time, I have the occasion to look at fatigue
failed joints. The lab analysis we've got states this, but does not abounds
in details.
One of the conclusions is "the crack propagates around harder Sn shearing
the softer Pb, but the Sn and Pb zones seem fairly large for regular solder
structure". Citing from Klein Wassink "During cyclic plastic deformation the
microstructure inside the material changes in the zones where the
deformation is concentrated. This leads to local grain growth..."
I have deposited the micro-sections on the IPCs website
http://ipc-technet.groupsite.com/gallery/13116
I would need your expert opinion regarding the failure. Is this fatigue? The
big pure Sn and pure Pb areas, are they normal size for fatigued joints?
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>
W | www.digico.cc <http://www.digico.cc/>
N'imprimer que si nécessaire - Print only if you must
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