Sure, the pidgeon has lifted .
Inge
--------------------------------------------------
From: "Grant Emandien" <[log in to unmask]>
Sent: den 1 April 2010 02:30
To: <[log in to unmask]>
Subject: Re: [TN] FW: Tear drops?
> Hi Inge,
>
> Could I piggy-back on your offer for a copy of the report?
>
>
> Regards
> Grant Emandien
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
> Sent: Thursday, April 01, 2010 11:06
> To: [log in to unmask]
> Subject: Re: [TN] FW: Tear drops?
>
> Iain,
>
> we have been doing some prototyping boards with VIP and non-filled. We
> base the job on a report that I'll send offline to you. You gain a lot of
> space for the fanouts, of course, but at the same time the requirement for
> precision is increasing. Our boards are laser drilled, think it was YAG.
> We were not satisfied with the first ones, debris problem and uneven
> centering.
> With non-filled vias there is a risk for solder voids. You need a very
> good X-ray equipment to judge the solder joint quality. What is the
> thickness of your boards and the number of I/Os for your packages. We have
> not series produced yet. The design engineers are very eager to get a go,
> because there are apparent advantages in terms of shorter transmission
> ways at GHz frequencies.
> What kind of products do you aim at?
>
> Inge
>
>
>
> --------------------------------------------------
> From: "Braddock, Iain (UK)" <[log in to unmask]>
> Sent: den 1 April 2010 01:13
> To: <[log in to unmask]>
> Subject: [TN] FW: Tear drops?
>
>> I guess from the lack of responses on this forum either you guy's are
>> too busy or don't use them.
>>
>> Perhaps a slightly shifted question:
>>
>> Is anyone using µvia in pad for µBGA/CSP & are you filling the via's &
>> with what?
>>
>> Regards,
>> Iain.
>>
>> ________________________________
>>
>> From: Braddock, Iain (UK)
>> Sent: 30 March 2010 10:07
>> To: [log in to unmask]
>> Subject: Tear drops?
>>
>>
>> Hi everyone,
>>
>> I'm interested in whether any of you feel there is a benefit of tear
>> drop designed pads on your boards to improve x-ray inspection and
>> whether you have implemented it and the associated difficulty tracking
>> especially <0.8mm pitched devices?
>>
>> Or perhaps you have implemented a design other than tear drop?
>>
>> Any comments would be very much appreciated.
>>
>> Regards,
>> Iain.
>>
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