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April 2010

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From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 19 Apr 2010 08:28:32 -0500
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Hi Roger! One of the issues with solder creep data is that you need to 
understand as completely as possible the conditions of the testing that 
generated the data. There is lots of solder creep data in the public 
domain but you need to use it cautiously. One source of solder mechanical 
property data that I have found useful in the "Solder Alloy Data" , 
International Tin Research Institute Publication #656. The test protocol 
for that data set is reasonably documented and reviewable. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




Roger Mack <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
04/14/2010 09:23 AM
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Subject
[TN] solder creep charts






Does anyone have a detailed solder creep graph (shear stress N/mm˛ vs. 
time to rupture) for tin lead solder?
I have been using Figure 4.35 from Klein Wassink's Soldering in 
Electronics. This graph starts at a shear stress of 1. 
We have run a ProE computer model that shows a shear stress value of 
0.6N/mm˛ on the connector pins of two boards that are mounted together. We 

have placed some samples to bake at the maximum service condition 
temperature to validate the computer model is realistic. It does not take 
much of an extrapolation error on a small text book graph to be off by an 
order of magnitude.



Roger Mack  P.Eng. 
Manufacturing Specialist
Parker Hannifin Electronic Controls
Electronic Controls Division
1305 Clarence Avenue
Winnipeg, MB  R3T 1T4 Canada 
direct 204 453 3339 x373
[log in to unmask]
www.parker.com/ecd





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