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April 2010

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Thu, 1 Apr 2010 02:05:55 -0700
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Iain,

we have been doing some prototyping boards with VIP and non-filled.  We base 
the job on a report that I'll send offline to you.  You gain a lot of space 
for the fanouts, of course, but at the same time the requirement for 
precision is increasing. Our boards are laser drilled, think it was YAG.  We 
were not satisfied with the first ones, debris problem and uneven centering. 
With non-filled vias there is a risk for solder voids.  You need a very good 
X-ray equipment to judge the solder joint quality.  What is the thickness of 
your boards and the number of I/Os for your packages. We have not series 
produced yet. The design engineers are very eager to get a go, because there 
are apparent advantages in terms of shorter transmission ways at GHz 
frequencies.
What kind of products do you aim at?

Inge



--------------------------------------------------
From: "Braddock, Iain (UK)" <[log in to unmask]>
Sent: den 1 April 2010 01:13
To: <[log in to unmask]>
Subject: [TN] FW: Tear drops?

> I guess from the lack of responses on this forum either you guy's are too 
> busy or don't use them.
>
> Perhaps a slightly shifted question:
>
> Is anyone using µvia in pad for µBGA/CSP & are you filling the via's & 
> with what?
>
> Regards,
>    Iain.
>
> ________________________________
>
> From: Braddock, Iain (UK)
> Sent: 30 March 2010 10:07
> To: [log in to unmask]
> Subject: Tear drops?
>
>
> Hi everyone,
>
> I'm interested in whether any of you feel there is a benefit of tear drop 
> designed pads on your boards to improve x-ray inspection and whether you 
> have implemented it and the associated difficulty tracking especially 
> <0.8mm pitched devices?
>
> Or perhaps you have implemented a design other than tear drop?
>
> Any comments would be very much appreciated.
>
> Regards,
>    Iain.
>
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