Switch is different compare to the edge connector (No. mating time
required is much higher).  Co hardening gold may be the stuff you want,
not the Ni hardening most of the stuff used nowadays.  You need to find
someone doing the special plating for you, not share the tank of gold
for those plating for connector, zif boards, etc.  you might want to pay
for a tank...

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, April 14, 2010 5:14 PM
To: [log in to unmask]
Subject: [TN] Question for "Old-Timers" about Gold

ya know, every time I think I know enough about a particular subject,
something comes along to make me realize there is more to it....

I need to order some boards using a fabrication drawing that hasn't been
updated in over fifteen years.
We need Hard Gold Electroplating for a rotary switch contacts.
One of the notes calls for gold knoop hardness 200-300, thickness
130-230
uin. 93.7% purity
 The last FAI report showed gold thickness of 160 uin. All other
historical
records are lost in the shifting sands of time

Our vendor has knoop hardness 150, 99.7% purity and says gold
requirement is
too thick.

IPC says knoop 150, gold minimum 31.5 uin. for edge connector fingers,
which
I assume is the same for contacts (doesn't seem to be addressed)

Printed Circuits Handbook says knoop 150,  thickness 25-50 uin for
non-military, 99.8% gold purity

Has gold plating changed that much since then?
Is there a danger of wear-out if I get 50uin. gold plating when our old
boards were 160 uin.?

surfin' the learnin' curve,
Jack


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