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April 2010

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Subject:
From:
Jack Olson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Date:
Wed, 14 Apr 2010 16:14:24 -0500
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ya know, every time I think I know enough about a particular subject,
something comes along to make me realize there is more to it....

I need to order some boards using a fabrication drawing that hasn't been
updated in over fifteen years.
We need Hard Gold Electroplating for a rotary switch contacts.
One of the notes calls for gold knoop hardness 200-300, thickness 130-230
uin. 93.7% purity
 The last FAI report showed gold thickness of 160 uin. All other historical
records are lost in the shifting sands of time

Our vendor has knoop hardness 150, 99.7% purity and says gold requirement is
too thick.

IPC says knoop 150, gold minimum 31.5 uin. for edge connector fingers, which
I assume is the same for contacts (doesn't seem to be addressed)

Printed Circuits Handbook says knoop 150,  thickness 25-50 uin for
non-military, 99.8% gold purity

Has gold plating changed that much since then?
Is there a danger of wear-out if I get 50uin. gold plating when our old
boards were 160 uin.?

surfin' the learnin' curve,
Jack


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