Got it. I'll take your advice with me next time I visit the group that
works with the problem. We know about Zy met. Good stuff. I just forgot.
Thanks / Inge
--------------------------------------------------
From: "SUBSCRIBE Technet Karl Loh" <[log in to unmask]>
Sent: den 30 March 2010 17:45
To: <[log in to unmask]>; "Ingemar Hernefjord" <[log in to unmask]>
Subject: Re: Vibration issue
> I suggest an underfill or edgebond adhesive. Zymet, www.zymet.com, has
> both reworkable and non-reworkable variants. These materials are used in
> handheld electronics and military electronics to enhance drop and
> vibration
> resistance. Zymet also has a product that is used specifically with
> TQFP's.
>
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