TGASIA Archives

April 2010

TGAsia@IPC.ORG
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multipart/alternative; boundary="----=_NextPart_000_0034_01CADBE1.7DEDC720"
Sender:
TGAsia <[log in to unmask]>
Subject:
Re: Bladder (bubble) on the solder mask after reflow
From:
WM-FQA-Zhao ZiDe <[log in to unmask]>
Date:
Wed, 14 Apr 2010 14:48:05 +0800
MIME-Version:
1.0
X-To:
Asia Committe Task Group Forum <[log in to unmask]>, 石红霞 <[log in to unmask]>
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, WM-FQA-Zhao ZiDe <[log in to unmask]>
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