TGASIA Archives

April 2010

TGAsia@IPC.ORG
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Sender:
TGAsia <[log in to unmask]>
X-To:
Asia Committe Task Group Forum <[log in to unmask]>, Frank Xiong <[log in to unmask]>
Date:
Wed, 7 Apr 2010 15:41:50 +0800
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, John Qian <[log in to unmask]>
Subject:
Re: Bladder (bubble) on the solder mask after reflow
From:
John Qian <[log in to unmask]>
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<[log in to unmask]>
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