Log In
LISTSERV Archives
Search Archives
Register
Log In
TGASIA Archives
April 2010
TGAsia@IPC.ORG
LISTSERV Archives
TGASIA Home
TGASIA April 2010
Log In
Register
Subscribe or Unsubscribe
Search Archives
Options:
Use Monospaced Font
Show Text Part by Default
Condense Mail Headers
Message:
[
<< First
] [
< Prev
]
[
Next >
] [
Last >>
]
Topic:
[
<< First
] [
< Prev
]
[
Next >
] [
Last >>
]
Author:
[<< First] [< Prev]
[Next >] [Last >>]
Content-Type:
multipart/alternative; boundary="----=_NextPart_000_0045_01CADBE2.920A7090"
Sender:
TGAsia <
[log in to unmask]
>
Subject:
Re: Bladder (bubble) on the solder mask after reflow
From:
朱慧 <
[log in to unmask]
>
Date:
Wed, 14 Apr 2010 14:55:49 +0800
MIME-Version:
1.0
X-To:
Asia Committe Task Group Forum <
[log in to unmask]
>, 石红霞 <
[log in to unmask]
>
Reply-To:
Asia Committe Task Group Forum <
[log in to unmask]
>, 朱慧 <
[log in to unmask]
>
Parts/Attachments:
text/plain
(2668 bytes) ,
text/html
(9 kB)
Your browser doesn't support iframes.
View Message
ATOM
RSS1
RSS2
LISTSERV.IPC.ORG