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March 2010

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Mon, 1 Mar 2010 16:10:53 -0500
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 Thanks Mike,
I appreciate it. Werner

 


 

 

-----Original Message-----
From: Mike Fenner <[log in to unmask]>
To: 'TechNet E-Mail Forum' <[log in to unmask]>; 'Werner Engelmaier' <[log in to unmask]>
Sent: Mon, Mar 1, 2010 5:06 am
Subject: RE: [TN] Roger Wild References


Werner
Please see attached Wild's 1975 InterNepcon Brighton Paper "Some fatigue
properties of solders and solder joints" which is probably covering the same
ground. Hope it helps.

Regards
 
Mike

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Tuesday, February 23, 2010 6:08 PM
To: [log in to unmask]
Subject: [TN] Roger Wild References

 Hi All,
I am in need of two references to published work from Roger Wild, IBM:
Wild, R., "Intermetallic Compounds and Their Effect on Solder Joint
Strengths," IBM No. 65-581-141, 1965;
Wild, R., "Effects of Cold on the Properties of Solder," Proc. Nepcon/West,
Anaheim, CA, February 1968, p. ??. 

 


First, I need the complete reference information, and second the actual
papers.
Werner


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