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March 2010

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Subject:
From:
Charming Chan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Sun, 7 Mar 2010 04:35:42 -0500
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Hello All, 
 
I'm working on the design of high speed line card for our high-end network router and plan to use buried capacitance to improve electrical performance. 

As known, both ZBC2000 and the next generation ultra-thin buried capacitance materials(3M C-Ply, FaradFlex BC24/BC16/BC12/BC16T) have advantages and disadvantages, respectively. To consider PCB manufacturing, PCB reliability, PCB cost, PCB lead-free assembly, and electrical perforance improvement, what kind of buried capacitance material is the best choice for high speed datacom products. Thanks a lot.

Best Regarads
Charming Chan


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