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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Fri, 5 Mar 2010 11:05:51 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (317 lines)
 Hi Scott,
The BGAs that warp are primarily the SBGAs, that have a built-in Cu heat spreader, which makes them thermally unbalanced.
Werner

 


 

 

-----Original Message-----
From: Post, Scott E <[log in to unmask]>
To: [log in to unmask]
Sent: Fri, Mar 5, 2010 9:56 am
Subject: Re: [TN] PAGODERING OR SMILING


Never heard the term before but, yes, I've seen BGAs with severe warp
after reflow.  In the cases I've seen "excessive heat" wasn't the issue.
The parts simply warped during normal reflow temperatures, often causing
ball-in-cup (or head in pillow, whatever you want to call it).  I've
spent way too much time doing Thermoire simulating reflow for this
issue.  If you're seeing the warp locked in after reflow then something
in the BGA suppliers materials or processes is the root cause.


Scott Post 
P.O.U. 0000-001E-0CTC
2151 E. Lincoln Road 
Kokomo, Indiana    46904-9005 
765-451-2983 (Phone) 
765-451-0287 (FAX) 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Christopher Young
Sent: Friday, March 05, 2010 9:00 AM
To: [log in to unmask]
Subject: Re: [TN] PAGODERING OR SMILING

Basically its where BGA plastic packaged components are subjected to
excess heat and lift at either end hence the term smiling, it lifts at
either end. Would like to know if anyone else has experienced this and
what tips anyone can offer to overcome this. Also what devices are prone
to this.

Thanks

Chris



-----Original Message-----
From: Dean Stadem [mailto:[log in to unmask]]
Sent: 05 March 2010 13:55
To: 'TechNet E-Mail Forum'; Christopher Young
Cc: 'Steve Gregory'
Subject: RE: [TN] PAGODERING OR SMILING

Chris,
Send a picture to Steve Gregory at [log in to unmask], and he will
post it so we can see what it is you are speaking of. I have never heard
the term before. 

R. Dean Stadem
Consulting Engineer
Analog Technologies Corp./Lumagine, Inc.
11441 Rupp Drive
Burnsville, MN 55431
(952)894-9228
[log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Christopher Young
Sent: Friday, March 05, 2010 2:47 AM
To: [log in to unmask]
Subject: Re: [TN] PAGODERING OR SMILING

Could someone advise on what you can do if you have pagodering or
smiling on components and which ones / types are suspect.

 Chris 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: 05 March 2010 06:55
To: [log in to unmask]
Subject: Re: [TN] Conformal Coat Over No-Clean Flux

25 or so years ago, Wally's (Rubin) Wonder Flux (Multicore Xersin),
which was claimed to be inert after soldering, had a CC variant that
could be applied over the residues. I never tested it, mainly because
WWF was not really the best flux in the world for oxidised leads. 
Theooretically, it sounds as if it may do the job.

Brian

Ken Bloomquist wrote:
> We have a twelve leaded, through-hole component that has to be hand
soldered
> on the circuit board. The assembly gets conformal coated with
urethane. We
> would like to hand solder these twelve leads using no-clean and then 
> conformal coat the board. The component would be added as a final step
after
> the assembly has first been cleaned.
> 
> Since this is not a "total no-clean" process do you see any issues
applying
> conformal coat over these twelve no-clean solder joints?
> 
> Best regards,
> 
> KennyB
> 
> 
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