HI all, I'm only getting here once or twice a week at present, but was
tipped off by a colleague about this thread this morning.
I try and summarise where we are:
RNT is now part of Indium Corporation with the technology and key people in
Utica.
The product has already made an impact in some designated areas such as
bonding target base plates. How 'big' an impact you can gauge for yourselves
http://www.rntfoil.com/site/applications/sputter-target-bonding/generation-1
0-sputtering-target
In our part of industry a number of slightly less dramatic applications are
well advanced/in production which benefit from the key fact that you don't
have to heat the assembly to heat the joint. Polymer LEDs is a great
example. If you have watched the video you will already have realised that
die attach heat sink attach and so on are also prime.
So far as SMT is concerned we are working with development partners and I
have to say seeing a pick and place machine [no printer no oven] turning out
an SMT like assembly is both fascinating.... and well... fascinating. This
was at prototype stage a few months ago. Note the words 'SMT like' before
you start planning to free up floor space :)
One of the minor problems with this technology is that it is too
interesting. I am not sales/marketing so do not determine policy direction.
But I would say whereas we are always happy to hear from people, we are
especially happy to hear from people who want to work on a case or project
basis AND where the technology brings a benefit. It is only affordable if
that's the case. Being "cool" won't get past anyone's bean counters!
We are continuingly developing process knowledge and data and have good
(strong) reliability numbers for certain applications. We also are building
knowledge of what will and won't work (including some counter intuitive in
both directions).
Regards
Mike
Mike Fenner, Technical Manager
Indium Corporation
Europe -----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Thursday, March 04, 2010 9:14 PM
To: [log in to unmask]
Subject: Re: [TN] [LF] Soldering with Nanofoils
Bev,
Yes, I was hoping that Mike Fenner may have some input.
Seems like it could be relatively easily deposited on the back of power
mosfet wafers prior to dicing, etc. Could be deposited on heatsinks and
heat spreaders of various composition and shape and size.
It would be a waste of nanofoil, but one could laminate/bond it to the foil
used to form the RF shields. Curious if you could make window frame
performs from the nanofoil - if they would have enough robustness to hold up
to handling.
Got a couple better ideas, but won't spread them out here.
Will see what Mike comes back with :-)
Steve C
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Thursday, March 04, 2010 3:46 PM
To: [log in to unmask]
Subject: Re: [TN] [LF] Soldering with Nanofoils
Steve,
1) Also the company has now been bought by Indium Corporation of America.
2) The big challenge is how do you place the thin foil, especially in a high
volume environment? I'm trying to interest people internally to see if it
would be a good fit for when RF cans have to be reworked.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Thursday, March 04, 2010 3:30 PM
To: [log in to unmask]
Subject: Re: [TN] [LF] Soldering with Nanofoils
Steve,
I had some contacts with Nano Technologies, at one time they were right up
the road from where I live. They were looking at doing some projects for
automated use of the foil and since I knew PnP machines well and I wrote a
lot of code it was a good match.
I have played with the material, it is really neat stuff. You can do large
scale soldering "In A Flash".
As for the strength of the joints their demo kit had two 1 inch square
pieces of solder coated copper. In a "Flash" they get soldered and you can
not pull them apart. I tried it in a vise and a hammer trying to shear the
two blocks. No Way.
Bob Kondner
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Thursday, March 04, 2010 1:34 PM
To: [log in to unmask]
Subject: Re: [TN] [LF] Soldering with Nanofoils
Eric,
Your question nicely leads into one that I have been pondering the last few
days - the use of Nanofoils in soldering/SMD applications. I am just
beginning to look into this but thought I might get some field experience
opinions from the forums.
One can go to the Reactive NanoTechnologies web site at
http://www.rntfoil.com/site/
At least one design realization consists of a foil created by alternating
layers of nm thick Al & Ni. Said foil would be placed between two
solder-coated surfaces, or solder performs. The foil would be ignited
[soldering iron, laser, etc] and the highly exothermic, self-propagating
reaction would locally reflow the solderable surfaces creating a bond. The
rapid exothermic process would minimize delta CTE issues between components,
leaving the bulk temperature of the components well below what they would
experience during a 'normal' reflow process.
Leaving aside for the moment, any issues related to possibly having to
physically hold the components in place during the process, I have two
predominantly material questions -
1 - Has anyone attempted to use this in a production environment yet?
2 - What happens to the strength of the joints, assuming the by-products of
the reaction stay within the interfacial region?
Just curious. Seems like a nice tool looking for an application.
Steve C
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Eric Bonatti
Sent: Thursday, March 04, 2010 11:23 AM
To: [log in to unmask]
Subject: [LF] magnetic solders?
Hello all,
Have you folks seen this?
http://www.articleant.com/gen/13521-new-magnetic-solders-are-a-leap-towards-
green-alternatives.html
I'm really curious to hear your thoughts on it.
Thanks,
Eric Bonatti, C.I.D.+
EDA and Engineering Services Group Leader
Phone: +1.905.812.6200 xt.3412
Mobile: +1.416.294.1194
E-mail: [log in to unmask]
Psion Teklogix Inc.
2100 Meadowvale Boulevard,
Mississauga, ON, L5N 7J9, Canada
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