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March 2010

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Subject:
From:
Robert Kondner <[log in to unmask]>
Reply To:
Date:
Thu, 4 Mar 2010 15:31:49 -0500
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I love no clean fluxes and no final steps. Stencil time and process windows
are probably the best. Trouble is there always seems to be a final step and
the flux becomes a major problem.

Bob Kondner

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Thursday, March 04, 2010 1:07 PM
To: [log in to unmask]
Subject: Re: [TN] Conformal Coat Over No-Clean Flux

 Hi KennyB,
I am not a friend of no-clean fluxes-I have seen too many issues involving
the flux residues unless it is the final step.
Werner

 


 

 

-----Original Message-----
From: Ken Bloomquist <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Mar 4, 2010 12:20 pm
Subject: [TN] Conformal Coat Over No-Clean Flux


We have a twelve leaded, through-hole component that has to be hand soldered
on the circuit board. The assembly gets conformal coated with urethane. We
would like to hand solder these twelve leads using no-clean and then
conformal coat the board. The component would be added as a final step after
the assembly has first been cleaned.

Since this is not a "total no-clean" process do you see any issues applying
conformal coat over these twelve no-clean solder joints?

Best regards,

KennyB


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