Steve,
I had some contacts with Nano Technologies, at one time they were right up
the road from where I live. They were looking at doing some projects for
automated use of the foil and since I knew PnP machines well and I wrote a
lot of code it was a good match.
I have played with the material, it is really neat stuff. You can do large
scale soldering "In A Flash".
As for the strength of the joints their demo kit had two 1 inch square
pieces of solder coated copper. In a "Flash" they get soldered and you can
not pull them apart. I tried it in a vise and a hammer trying to shear the
two blocks. No Way.
Bob Kondner
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Thursday, March 04, 2010 1:34 PM
To: [log in to unmask]
Subject: Re: [TN] [LF] Soldering with Nanofoils
Eric,
Your question nicely leads into one that I have been pondering the last few
days - the use of Nanofoils in soldering/SMD applications. I am just
beginning to look into this but thought I might get some field experience
opinions from the forums.
One can go to the Reactive NanoTechnologies web site at
http://www.rntfoil.com/site/
At least one design realization consists of a foil created by alternating
layers of nm thick Al & Ni. Said foil would be placed between two
solder-coated surfaces, or solder performs. The foil would be ignited
[soldering iron, laser, etc] and the highly exothermic, self-propagating
reaction would locally reflow the solderable surfaces creating a bond. The
rapid exothermic process would minimize delta CTE issues between components,
leaving the bulk temperature of the components well below what they would
experience during a 'normal' reflow process.
Leaving aside for the moment, any issues related to possibly having to
physically hold the components in place during the process, I have two
predominantly material questions -
1 - Has anyone attempted to use this in a production environment yet?
2 - What happens to the strength of the joints, assuming the by-products of
the reaction stay within the interfacial region?
Just curious. Seems like a nice tool looking for an application.
Steve C
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Eric Bonatti
Sent: Thursday, March 04, 2010 11:23 AM
To: [log in to unmask]
Subject: [LF] magnetic solders?
Hello all,
Have you folks seen this?
http://www.articleant.com/gen/13521-new-magnetic-solders-are-a-leap-towards-
green-alternatives.html
I'm really curious to hear your thoughts on it.
Thanks,
Eric Bonatti, C.I.D.+
EDA and Engineering Services Group Leader
Phone: +1.905.812.6200 xt.3412
Mobile: +1.416.294.1194
E-mail: [log in to unmask]
Psion Teklogix Inc.
2100 Meadowvale Boulevard,
Mississauga, ON, L5N 7J9, Canada
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