Hello 

Can you be more specific about your package design.
Just a curiosity, what do you mean by "a JEDEC tray of balled packages"?

You can get coplanarity from the PCB side using optical method.I have used Shadow Morie' before.With a accuracy of  micron at room temperature. 

Al


 



________________________________
From: Prashant Joshi <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, March 2, 2010 1:46:57 PM
Subject: [TN] BGA ball coplanarity inspection equipment

Hello,

I am looking for scanning equipment to measure flatness and coplanarity of 
BGA packages and would appreciate recommendations.  We would like to place 
a JEDEC tray of balled packages and get readings for the whole tray in about a 
minute.  This is to support high volume manufacturing.  Ball pitch could be 0.4 -
0.5 mm or higher.  If you have a recommendation, will you please also share 
what you like/dislike about it?

Thanks for your help,

Prashant Joshi
Interconnect Systems Inc.
(805) 482-2870

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