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March 2010

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Subject:
From:
Chuck Brummer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 31 Mar 2010 16:05:44 -0700
Content-Type:
text/plain
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text/plain (107 lines)
Steve,

We do this all the time.  Our smallest vias at 1 mil and smaller at the 
exit side.  Of course if you put more than .0002 plating in the holes some 
will close.

Chuck Brummer
3M Manufacturing Engineer
8357 Canoga Ave.
Canoga Park, CA 91304-2605
(818) 734-4930




From:
Steve Kelly <[log in to unmask]>
To:
[log in to unmask]
Date:
03/31/2010 12:24 PM
Subject:
[TN] Laser vias
Sent by:
TechNet <[log in to unmask]>



Hi All,

Anyone have any experience on a .001 laser via drilled through .0005 
copper
and a .002 thick polyimide. The opening on the bottom side of the laser 
hole
is supposed to be .0004-.0006 with the taper. Can this be plated reliably?
Would an additive process make this better?

Thanks in advance. Steve Kelly

 

 

 

 

 

 

PFC_2col.png

CREATING A FLEXIBLE FUTURE

 

Steve Kelly 

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)

 



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