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March 2010

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Subject:
From:
Steve Kelly <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Kelly <[log in to unmask]>
Date:
Wed, 31 Mar 2010 16:10:06 -0400
Content-Type:
text/plain
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There is a 150 micro inch layer of nickel under the electroless gold.
Regards Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: March-31-10 3:50 PM
To: [log in to unmask]
Subject: Re: [TN] Wire bondable gold

You encapsulate traces/pads with Electroless Gold and eliminate future
contaminations due to copper/nickel corrosion I guess.
------Original Message------
From: Steve Kelly
Sender: TechNet E-Mail Forum.
To: TechNet E-Mail Forum.
ReplyTo: TechNet E-Mail Forum.
ReplyTo: Steve Kelly
Subject: [TN] Wire bondable gold
Sent: Mar 31, 2010 3:20 PM

Hi all,

Anyone know a reason why a customer would call up 20 micro inches of
electroless gold followed by 50 micro inches of electroplated soft gold for
thermosonic gold wire bonding? Is there an advantage to having the
electroless underneath?

Regards Steve Kelly













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CREATING A FLEXIBLE FUTURE



Steve Kelly

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)




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Aleks Lozinsky
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