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March 2010

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Subject:
From:
stephengregory5849 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, stephengregory5849 <[log in to unmask]>
Date:
Thu, 25 Mar 2010 21:49:18 -0400
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Hi Bev,

Don't leave us hanging, what components are you seeing that with? I'd like 
to have a "heads-up".

This begs the question, why do you think they are doing that? Are things 
getting so tight that they're trying to pinch a penny by reducing plating 
coverage? Hmmmm...

Steve

----- Original Message ----- 
From: "Bev Christian" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, March 25, 2010 9:08 PM
Subject: [TN] Need some opinions


> Technetters,
> It seems that more and more component suppliers are not plating their 
> leads
> all the way up to the component body. In fact some are getting downright
> skimpy and only plating to the bottom bend, never mind the upper one. If 
> you
> put down a lot of solder paste you end up with a bulbous joint, a negative
> wetting angle and a stress concentration point. If you put down less paste
> and have a co-planarity issue, then you have the potential for opens.  The
> other option of course is getting the supplier to plate higher up the 
> leads.
>
> Question: would you consider the condition of the formation of the 
> negative
> wetting angles a failure during process qualification?
>
> Bev
> RIM
>
>
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