Technetters,
It seems that more and more component suppliers are not plating their leads
all the way up to the component body. In fact some are getting downright
skimpy and only plating to the bottom bend, never mind the upper one. If you
put down a lot of solder paste you end up with a bulbous joint, a negative
wetting angle and a stress concentration point. If you put down less paste
and have a co-planarity issue, then you have the potential for opens.  The
other option of course is getting the supplier to plate higher up the leads.

Question: would you consider the condition of the formation of the negative
wetting angles a failure during process qualification?

Bev
RIM


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