Hi Bob,
Good insight.
Werner
-----Original Message-----
From: Robert Kondner <[log in to unmask]>
To: 'TechNet E-Mail Forum' <[log in to unmask]>; 'Werner Engelmaier' <[log in to unmask]>
Sent: Thu, Mar 25, 2010 9:02 am
Subject: RE: [TN] TI/Emerson SMT Board Mounted Power
Werner,
What you said makes sense. That column of metal in the "Solder Ball" is
like a reinforcing rod in concrete, Stresses will be concentrated in the
solder ball at the end of the shaft. (Did I get that right?)
This made me think about QFN and LGA (Leadless Grid Array) devices. If the
layer of solder between device and PCB is very thin then any expansion
difference is going to be concentrated into the thin solder.
Did I get that right? Kind of makes me appreciate Gull Wings a whole lot
more.
Bob Kondner
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Wednesday, March 24, 2010 2:21 PM
To: [log in to unmask]
Subject: Re: [TN] TI/Emerson SMT Board Mounted Power
Hi Bob,
Sure did.
The difference is a rigid pin soldered down in a butt joint vs. a soft
forgiving (somewhat in SAC's case) solder ball that behaves very
differently.
Werner
-----Original Message-----
From: Bob Landman <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier
<[log in to unmask]>
Cc: [log in to unmask] <[log in to unmask]>
Sent: Wed, Mar 24, 2010 7:33 am
Subject: Re: [TN] TI/Emerson SMT Board Mounted Power
Werner,
Why would the Autosplice technique (which is apparently what TI uses) behave
any different than a large BGA thermally? Have you looked at the animation
drawing in the Autosplice datasheet?
Bob
Sent from my iPhone
On Mar 23, 2010, at 4:47 PM, Werner Engelmaier <[log in to unmask]> wrote:
> If they were flexible that would work-but the picture sure does not > make
them look flexible.
> Werner
>
>
>
>
>
>
>
>
> -----Original Message-----
> From: Thayer, Wayne - IIW <[log in to unmask]>
> To: [log in to unmask]
> Sent: Tue, Mar 23, 2010 4:34 pm
> Subject: Re: [TN] TI/Emerson SMT Board Mounted Power
>
>
> But Werner, what if the legs are very malleable? Won't it be more > like
a CGA
> then? (Of course, if they were that flexible, the package would >
probably need
> another technique to support its body.)
>
> Wayne Thayer
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
> Sent: Tuesday, March 23, 2010 3:30 PM
> To: [log in to unmask]
> Subject: Re: [TN] TI/Emerson SMT Board Mounted Power
>
> Hi Bob & Graham,
> Be very careful using these-this is a pin grid array with butt-> joints in
> disguise.
> It will work if you have not much of a thermal expansion mismatch >
between
> component and PCB, but if you do you will get very early solder > joint
failures.
> Werner
>
>
>
>
>
>
>
>
> -----Original Message-----
> From: Bob Landman <[log in to unmask]>
> To: [log in to unmask]
> Sent: Tue, Mar 23, 2010 2:42 pm
> Subject: Re: [TN] TI/Emerson SMT Board Mounted Power
>
>
> Graham,
>
> While I have not tried this clever device, it seems like a good way > to
solve the
> problem.
>
> See http://www.autosplice.com/solderball-pins/
>
> "Eliminates Coplanarity Concerns When Soldering Parallel PC Boards
>
> Packaged in Tape Reel for use with standard feeders for automated >
placement. The
> product contains a Solderball that maintains its shape during > multiple
solder
> reflow processes. The PC board or device can then easily be soldered > to
pads on
> another parallel PC board. The Solderball pins accommodate up to .> 020"
(0.5mm)
> coplanarity variation with high current reliability."
>
> Bob Landman
> H&L Instruments, LLC
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins
> Sent: Tuesday, March 23, 2010 8:45 AM
> To: [log in to unmask]
> Subject: Re: [TN] TI/Emerson SMT Board Mounted Power
>
> Hi Russell
> Is it skewed before it goes into the reflow oven? If yes, then a >
placement
> issue. If it looks OK before reflow oven and is skewed after the > reflow
oven
> then obviously is moving in there - which points to a pad size > problem.
>
> If their placement is good and it is skewing in the oven, one trick > we
have used
> in the past is to dispense a glue dot under the component body
> - it will hold the alignment during reflow. We have used this > method
when pad
> layout is not quite right and the alignment is critical to meet IPC->
A-610
> requirements (e.g. for heel fillet). They would need to have glue >
dispense
> capability though.
>
> regards,
> - Graham
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Nowland, Russell >
Howard
> (Russell)
> Sent: Monday, March 22, 2010 4:57 PM
> To: [log in to unmask]
> Subject: [TN] TI/Emerson SMT Board Mounted Power
>
> Hello Technetters,
>
> I have a problem I hope someone out there has a solution for.
>
> I have on a PCA that uses a Texas Instrument/(Emerson Power/Artesyn) >
(dual
> sourced but part of the POLA) SMT board mounted power converter.
> The MPN is PTH03050WAS. It is actually combination PTH and SMT. > The
device has
> 40 mil diameter pins for PTH and to make it SMT they simply add a > donut
(solder
> dam) on the pin and round the edges and call it a solder ball. I > think
the
> problem my EMS is having is really with pick-n-place because the > pick-up
point
> (Actually the top of a
> transformer) is off-center, fairly small, and it has a plastic label > on
it.
>
> The problem is the device is coming out of the oven skewed and > violating
IPC
> 610D. The pad diameter is exactly what is recommended by the > datasheet
> (.085-inches). The TI datasheet recommended a 0.080-0.085 diameter >
aperture @
> six mils. Originally my EMS had 0.085-inch @ 5 mils but changed the >
aperture to
> a bull's-eye shape with the thought the bull's-eye would help center > the
device.
> Both of the stencils have failed to draw the device to the center.
>
> Because this is really a Butt Joint I am holding the EMS to no side >
overhang.
> This is causing them quite a headache. They have also not come up > with a
viable
> solution either.
>
> Here is the link to the data sheet
>
> http://www.emerson.com/sites/network_power/en-US/Products/Product_Detail
> /Product1/Documents/PTH03050%20DC-DC%20Converter/PTH03050%20Data> %20Sheet
> .pdf
>
>
>
> Has anybody used these devices with good results? If so can you > share
your
> methodology?
>
> Thanks in advanced,
>
>
> Russell Nowland
> Alcatel-Lucent
> Advanced Manufacturing Engineer
> Address: 14000 Quail Spring Parkway, Suite 300 Oklahoma City, OK 73134
> email:
> [log in to unmask]<mailto:russell.nowland@alcatel-> lucent
> .com>
> Desk: 405-302-1660
> Cell: 405-203-0034
> Fax: 405-302-1622
>
>
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