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March 2010

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 24 Mar 2010 15:40:08 -0500
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Hi Steve - my comments:

1) There are ImSn pwb surface finish formulations that will produce tin 
whiskers and there are ImSn pwb surface finish formulations that will not 
produce tin whiskers.  Conduct testing and don't completely believe the 
Marketing literature.

2) There are only a handful of published reports (3) which show a tin 
whisker growing out of SAC305 solder. The reports show that excessive 
ionic cleanliness levels were the root cause of the tin whiskers. There 
are several industry investigation currently in progress on the specific 
topic of ionic cleanliness levels and tin whiskers. Best guess is that 
some of the investigations will be published later this year. 

Dave Hillman
Rockwell Collins
[log in to unmask]




Steve Kelly <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
03/24/2010 12:30 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Steve Kelly <[log in to unmask]>


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Subject
[TN] Tin Whiskers






Hi All,

Two questions today:

1)      Any known instances of tin whiskering when the finish is Immersion 
Tin

2)      Any known instances of tin whiskering after the immersion tin is 
soldered with a RoHS compliant solder such as SAC 305.

Thanks. Steve Kelly













PFC_2col.png

CREATING A FLEXIBLE FUTURE



Steve Kelly

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)




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