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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Wed, 24 Mar 2010 14:21:25 -0400
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text/plain (319 lines)
 Hi Bob, 
Sure did.
The difference is a rigid pin soldered down in a butt joint vs. a soft forgiving (somewhat in SAC's case) solder ball that behaves very differently.
Werner

 


 

 

-----Original Message-----
From: Bob Landman <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier <[log in to unmask]>
Cc: [log in to unmask] <[log in to unmask]>
Sent: Wed, Mar 24, 2010 7:33 am
Subject: Re: [TN] TI/Emerson SMT Board Mounted Power


Werner, 
 
Why would the Autosplice technique (which is apparently what TI uses) behave any different than a large BGA thermally?  Have you looked at the animation drawing in the Autosplice datasheet? 
 
Bob 
 
Sent from my iPhone 
 
On Mar 23, 2010, at 4:47 PM, Werner Engelmaier <[log in to unmask]> wrote: 
 
> If they were flexible that would work—but the picture sure does not > make them look flexible. 
> Werner 
> 
> 
> 
> 
> 
> 
> 
> 
> -----Original Message----- 
> From: Thayer, Wayne - IIW <[log in to unmask]> 
> To: [log in to unmask] 
> Sent: Tue, Mar 23, 2010 4:34 pm 
> Subject: Re: [TN] TI/Emerson SMT Board Mounted Power 
> 
> 
> But Werner, what if the legs are very malleable?  Won't it be more > like a CGA 
> then?  (Of course, if they were that flexible, the package would > probably need 
> another technique to support its body.) 
> 
> Wayne Thayer 
> 
> -----Original Message----- 
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier 
> Sent: Tuesday, March 23, 2010 3:30 PM 
> To: [log in to unmask] 
> Subject: Re: [TN] TI/Emerson SMT Board Mounted Power 
> 
> Hi Bob & Graham, 
> Be very careful using these-this is a pin grid array with butt-> joints in 
> disguise. 
> It will work if you have not much of a thermal expansion mismatch > between 
> component and PCB, but if you do you will get very early solder > joint failures. 
> Werner 
> 
> 
> 
> 
> 
> 
> 
> 
> -----Original Message----- 
> From: Bob Landman <[log in to unmask]> 
> To: [log in to unmask] 
> Sent: Tue, Mar 23, 2010 2:42 pm 
> Subject: Re: [TN] TI/Emerson SMT Board Mounted Power 
> 
> 
> Graham, 
> 
> While I have not tried this clever device, it seems like a good way > to solve the 
> problem. 
> 
> See http://www.autosplice.com/solderball-pins/ 
> 
> "Eliminates Coplanarity Concerns When Soldering Parallel PC Boards 
> 
> Packaged in Tape Reel for use with standard feeders for automated > placement. The 
> product contains a Solderball that maintains its shape during > multiple solder 
> reflow processes. The PC board or device can then easily be soldered > to pads on 
> another parallel PC board. The Solderball pins accommodate up to .> 020" (0.5mm) 
> coplanarity variation with high current reliability." 
> 
> Bob Landman 
> H&L Instruments, LLC 
> 
> -----Original Message----- 
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins 
> Sent: Tuesday, March 23, 2010 8:45 AM 
> To: [log in to unmask] 
> Subject: Re: [TN] TI/Emerson SMT Board Mounted Power 
> 
> Hi Russell 
> Is it skewed before it goes into the reflow oven?  If yes, then a > placement 
> issue.  If it looks OK before reflow oven and is skewed after the > reflow oven 
> then obviously is moving in there - which points to a pad size > problem. 
> 
> If their placement is good and it is skewing in the oven, one trick > we have used 
> in the past is to dispense a glue dot under the component body 
> - it will hold the alignment during reflow.  We have used this > method when pad 
> layout is not quite right and the alignment is critical to meet IPC-> A-610 
> requirements (e.g. for heel fillet).  They would need to have glue > dispense 
> capability though. 
> 
> regards, 
> - Graham 
> 
> -----Original Message----- 
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Nowland, Russell > Howard 
> (Russell) 
> Sent: Monday, March 22, 2010 4:57 PM 
> To: [log in to unmask] 
> Subject: [TN] TI/Emerson SMT Board Mounted Power 
> 
> Hello Technetters, 
> 
> I have a problem I hope someone out there has a solution for. 
> 
> I have on a PCA that uses a Texas Instrument/(Emerson Power/Artesyn) > (dual 
> sourced but part of the POLA) SMT board mounted power converter. 
> The MPN is PTH03050WAS.  It is actually combination PTH and SMT.  > The device has 
> 40 mil diameter pins for PTH and to make it SMT they simply add a > donut (solder 
> dam) on the pin and round the edges and call it a solder ball.  I > think the 
> problem my EMS is having is really with pick-n-place because the > pick-up point 
> (Actually the top of a 
> transformer) is off-center, fairly small, and it has a plastic label > on it. 
> 
> The problem is the device is coming out of the oven skewed and > violating IPC 
> 610D.  The pad diameter is exactly what is recommended by the > datasheet 
> (.085-inches).  The TI datasheet recommended a 0.080-0.085 diameter > aperture @ 
> six mils.  Originally my EMS had 0.085-inch @ 5 mils but changed the > aperture to 
> a bull's-eye shape with the thought the bull's-eye would help center > the device. 
> Both of the stencils have failed to draw the device to the center. 
> 
> Because this is really a Butt Joint I am holding the EMS to no side > overhang. 
> This is causing them quite a headache. They have also not come up > with a viable 
> solution either. 
> 
> Here is the link to the data sheet 
> 
> http://www.emerson.com/sites/network_power/en-US/Products/Product_Detail 
> /Product1/Documents/PTH03050%20DC-DC%20Converter/PTH03050%20Data> %20Sheet 
> .pdf 
> 
> 
> 
> Has anybody used these devices with good results?  If so can you > share your 
> methodology? 
> 
> Thanks in advanced, 
> 
> 
> Russell Nowland 
> Alcatel-Lucent 
> Advanced Manufacturing Engineer 
> Address: 14000 Quail Spring Parkway, Suite 300 Oklahoma City, OK 73134 
> email: 
> [log in to unmask]<mailto:russell.nowland@alcatel-> lucent 
> .com> 
> Desk: 405-302-1660 
> Cell: 405-203-0034 
> Fax: 405-302-1622 
> 
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