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March 2010

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Subject:
BGA ball coplanarity inspection equipment
From:
Prashant Joshi <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Prashant Joshi <[log in to unmask]>
Date:
Tue, 2 Mar 2010 12:46:57 -0600
Content-Type:
text/plain
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text/plain (25 lines) 
Hello,

I am looking for scanning equipment to measure flatness and coplanarity of 
BGA packages and would appreciate recommendations.  We would like to place 
a JEDEC tray of balled packages and get readings for the whole tray in about a 
minute.  This is to support high volume manufacturing.  Ball pitch could be 0.4 -
0.5 mm or higher.  If you have a recommendation, will you please also share 
what you like/dislike about it?

Thanks for your help,

Prashant Joshi
Interconnect Systems Inc.
(805) 482-2870

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