Hi Paul,
they are listed right below my signature.
Werner
Upcoming workshops:
May 21, IPC Int. Conference on Reliability andQuality of Lead-Free Electronics, Frankfurt, Germany,
“Reliability Issues and SolutionOptions for Pb-Free Soldered Electronic Products”
May 26, FED Seminar, Stuttgart, Germany,
“Bleifreie Lötprozesse—Frühausfälle,Qualität, Zuverlässigkeit”
June 8, SMT/HYBRID/PACKAGING 2010, Nürnberg,Germany,
“Reliability Issues with Lead-FreeSoldering”
-----Original Message-----
From: Paul Reid <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier <[log in to unmask]>
Sent: Thu, Mar 18, 2010 2:33 pm
Subject: RE: [TN] thermo shock cycles
Hi Werner,
Where and when are your workshops?
Sincerely,
Paul Reid
Program Coordinator
PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1
613 596 4244 ext. 229
Skype paul_reid_pwb
[log in to unmask] <mailto:[log in to unmask]>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: March 18, 2010 11:42 AM
To: [log in to unmask]
Subject: Re: [TN] thermo shock cycles
Hi Torsten,
First 15°C/min is NOT thermal shock-by definition, thermal shock produces
thermal gradients large enough to cause significant warpages-that requires at
least 30°C min.
Second, -40 <=> +140°C is ludicrous. At best you are confounding the effects of
multiple damage mechanisms, and at worst you get totally misleading results. And
this cannot possibly the mission environment.
Third, why 3,500 cycles? Based on what?
Because, of the confounding, there are no models that can be applied.
However, I could help you at least understand this situation-I will be giving
workshops in Germany in May/June-perhaps you can come.
Werner
Upcoming workshops:
May 21, IPC Int. Conference on Reliability andQuality of Lead-Free Electronics,
Frankfurt, Germany,
"Reliability Issues and SolutionOptions for Pb-Free Soldered Electronic
Products"
May 26, FED Seminar, Stuttgart, Germany,
"Bleifreie Lötprozesse-Frühausfälle,Qualität, Zuverlässigkeit"
June 8, SMT/HYBRID/PACKAGING 2010, Nürnberg,Germany,
"Reliability Issues with Lead-FreeSoldering"
-----Original Message-----
From: Torsten Hagge <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Mar 16, 2010 11:54 am
Subject: [TN] thermo shock cycles
Dear Technos,
we have a customer who recommended 3500 thermoshock cycles -40 to +140°C with
15°C/min gradient. Any ideas/suggestions which PCB material and lead free solder
can be used to fulfil this?
As other customers require much less thermo cycles for the same application any
hints how to calculate the required thermo cycles out of a mission profile and
when the formula for this kind of ALT test does not make any sense (as I think
3500 cycles is normally not reachable for standard PCB material and especially
for lead free solder)?
Best thanks in advance,
Torsten
Dipl.Ing.(FH)Torsten Hagge
tech. projectmanager
Kristronics GmbH
Gewerbegrund 5 - 9
24955 Harrislee
Tel.: +49 461 7741 624
Fax: +49 461 7741 642
[log in to unmask]
www.kristronics.de
Gerichtsstand Flensburg, Handelsregister: HRB 1433 FL
Geschäftsführer Dipl.-Ing. oec. Thormod Ohm
Ust-Id-Nr. DE 811182059
Bankverbindung: Deutsche Bank AG Flensburg, Konto-Nr. 4216610, BLZ 21570011
IBAN: DE32 2157 0011 0421 6610 00, BIC: DEUT DE HH 215
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