Thanks, Werner. I knew there was something important I was missing, and that’s a definite must-have.
Leland
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Wednesday, March 17, 2010 12:30 PM
To: [log in to unmask]; Leland Woodall
Subject: Re: [TN] Reflow Oven Comparison and Qualification
Hi Leland,
I do not know what your product mix/complexity/Rf-shields/Pb-free requirements are, but you should make sure you can run cooling rates of 1.5°C/sec or less.
Werner
Upcoming workshops:
May 21, IPC Int. Conference on Reliability and Quality of Lead-Free Electronics, Frankfurt, Germany,
“Reliability Issues and Solution Options for Pb-Free Soldered Electronic Products”
May 26, FED Seminar, Stuttgart, Germany,
“Bleifreie Lötprozesse—Frühausfälle, Qualität, Zuverlässigkeit”
June 8, SMT/HYBRID/PACKAGING 2010, Nürnberg, Germany,
“Reliability Issues with Lead-Free Soldering”
-----Original Message-----
From: Leland Woodall <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Mar 17, 2010 10:34 am
Subject: [TN] Reflow Oven Comparison and Qualification
Technetters,
We're preparing to purchase eight to ten forced convection reflow ovens
to replace equipment we currently have. We also have plans to attend
APEX to check out the varieties available and their features.
Being a Quality guy, I'm concerned about items that include:
Ability to hold temp within 1 to 2 degrees C
Flux management systems
Nitrogen control, with expected levels of 50 to 100 O2 PPM (max 500 PPM)
Oxygen analyzer type, sampling rate, etc.
Seals, exhaust system
8 to 10 zones
Board drop sensors
Auto width adjust
Ability to maintain parallelism from end to end with constant use
Ease of maintenance
Power consumption, cost of ownership
I know that I'm missing some important items. Will those that have a
few minutes please add to my list and elaborate upon what I should
investigate? I'd especially like to hear about personal experiences
with critical control designs (what's good, and what should be avoided
with all costs).
Many thanks, as always!
Leland
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