Nagaraj
I believe you are referring to ZettaCore's
Molecular Interface (TM) technology. It is not currently being offered as an OSP type product, though it would certainly have that capability.
At present MI technology is serving to improve electroless copper plating in printed circuit boards. By eliminating the need for any roughening of plastic surfaces to promote copper adhesion, two great advantages are gained: 1) gHz signal transmission improvement and 2) finer line/space definition. In IC substrates, under 10 microns has been attained.
Re your questions re shelf life, etc, HAST tests indicate that it might be a superior OSP, when and if it is offered for that application.
I refer you to the following for more information: http://www.pcb007.com/pages/zone.cgi?a=53298&artpg=1&topic=0
There you will find a link to Dr. Werner Kuhr's paper that describes the technology and HAST tests. Also refer to <www,ZettaCore.com>.
________________________________
From: "Shanmugam, Nagaraj" <[log in to unmask]>
To: [log in to unmask]
Sent: Mon, March 15, 2010 11:12:55 PM
Subject: SPAM-LOW: [TN] Organic Metal Nano surface finish
Dear TechNetters,
I recently got update on new Surface Finish 'Organic Metal Nano surface
finish' a replacement for existing finishes like OSP, Immersion Ag,
ENIG, Lead free HASL.
How this behaves interms of shelf life, Cost, Reliability, Fab &
Assembly, co-planarity, rework...
Any suggestions/reference to documents will be of much help.
TIA,
Nagaraj.
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