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March 2010

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Tue, 2 Mar 2010 07:38:05 -0500
Content-Type:
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text/plain (1 lines)
Thx. There is not enough of mfg trick to compensate half hearted design. As old say indicated. 
-------------------------- 
Sent using BlackBerry 


________________________________

From: Werner Engelmaier <[log in to unmask]> 
To: Joyce Koo; [log in to unmask] <[log in to unmask]> 
Sent: Tue Mar 02 07:08:30 2010
Subject: Re: [TN] BTC rework, Square SJs 


Hi Joyce,
The ball collapse comes from the combination of package weight, choice of paste, solder alloy, surface tension, amount of paste:pad area, extension of pad beyond package, but has little to do with reflow profile [provided it is adequate]---so 'finger-pointing' is misplaced---it is the design details in almost all cases.
By the way, there are non-collapsing balls available for Pb-free as well---they are just not made of solder.
Werner




-----Original Message-----
From: Joyce Koo <[log in to unmask]>
To: [log in to unmask]; [log in to unmask]
Sent: Mon, Mar 1, 2010 11:58 pm
Subject: Re: [TN] BTC rework, Square SJs


I am looking for a way to differentiate poor process (bad reflow profile) vs bad 

design.  If, say 5% - 20% collapse should be achieved by reflow, anything else, 

such as cte mismatch or pcb warpage would attributed to the bad design (I.e. Un 

balensed board, selected wrong pcb material) if such acceptable guideline can 

not be established, it would be a finger pointing game.  As much as I like the 

computer game (hehehe), but not any "finger pointing" type.  , 

--------------------------

Sent using BlackBerry





----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Mon Mar 01 23:31:01 2010

Subject: Re: [TN] BTC rework, Square SJs





 Hi Joyce,

No such valid shortcut--why not do the analysis? Or better yet, hire me.

Maybe it is time for Bev to bring me up for a workshop.

But it is really not that difficult.

Werner



 





 



 



-----Original Message-----

From: Joyce Koo <[log in to unmask]>

To: [log in to unmask]; [log in to unmask]

Sent: Mon, Mar 1, 2010 11:09 pm

Subject: Re: [TN] BTC rework, Square SJs





Werner,

Thx for the reply.  However, the old Pb rich ball solder to the board using 

eutectic can be ensure the proper stand off achieved.  At current lead free, 

there is a little attention being paid to achieve the proper standoffs.  As for 

the good workmanship and process, regardless the size and cte mismatch, should 

ipc establish a proper guideline, if not spec for establish % collapse of ball 

standoff requirements?  Rather than depends upon individual case of cte, parts?  



I have seen some squarches bga joints almost look like LGAs.  Sure it is not 

"good".  Can't wait for rel data to establish each of them.  Can so guru come 

out a number that universally acceptable?  At least meet the "intend of the 

design" in term of reliability.  Any takers?  

--------------------------

Sent using BlackBerry





----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Mon Mar 01 19:09:37 2010

Subject: Re: [TN] BTC rework, Square SJs





 Joyce,

That depends on the reliability you want to achieve, the package size, the 

delta-CTE and the cyclic delta-T.



Werner

Upcoming workshops:

May 21, IPC Int. Conference on Reliability and Quality of Lead-Free Electronics, 



Frankfurt, Germany,

      “Reliability Issues and Solution Options for Pb-Free Soldered Electronic 

Products”

May 26, FED Seminar, Stuttgart, Germany,

     “Bleifreie Lötprozesse—Frühausfälle, Qualität, Zuverlässigkeit”

June 8, SMT/HYBRID/PACKAGING 2010, Nürnberg, Germany,

     “Reliability Issues with Lead-Free Soldering”







 





 



 



-----Original Message-----

From: Joyce Koo <[log in to unmask]>

To: [log in to unmask]

Sent: Mon, Mar 1, 2010 6:09 pm

Subject: Re: [TN] BTC rework, Square SJs





Warner, 

What is the max collapse allowable of ball from its height? 

--------------------------

Sent using BlackBerry





----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Mon Mar 01 13:56:14 2010

Subject: Re: [TN] BTC rework, Square SJs





 Hi Chris,

The problem with this SJ is the low solder joint height 9=reduced reliability) 

and the stress concentration geometry from SMD.

Werner



 





 



 



-----Original Message-----

From: Chris Mahanna <[log in to unmask]>

To: Werner Engelmaier <[log in to unmask]>; [log in to unmask] <[log in to unmask]>

Sent: Mon, Mar 1, 2010 1:08 pm

Subject: RE: [TN] BTC rework, Square SJs







In cross section, the vertical sides of the joint are straight. I assume it has 

more/less retained the shape of the [trapezoidal?] stencil.

Chris

 



From: Werner Engelmaier[mailto:[log in to unmask] <mailto:[log in to unmask]> ] 

Sent: Monday, March 01, 2010 12:52 PM

To: [log in to unmask]; Chris Mahanna

Subject: Re: [TN] BTC rework, Square SJs



 



Chris,

What do you mean by "squarejoints?"

Werner



 



 



-----Original Message-----

From: Chris Mahanna <[log in to unmask]>

To: [log in to unmask]

Sent: Mon, Mar 1, 2010 12:15 pm

Subject: [TN] BTC rework, Square SJs



Are square joints simply due to the small mass of the components, or is it 









possibly an indicator of insufficient heat?  We have no indication that any of 









the paste didn't flow.  Wetting looks good.  All evidence is from microsection.



















Thanks,









Chris



















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