It is possible. We do it. To add to Joe's very good points, the ability
to clean is also dependent on the geometry of the unit, number of
entrapment sites, etc. The first flux can harden to some extent, but
that depends on the fluxes you use. It can be done, but you have to
carefully select your fluxes, cleaning agents, cleaning equipment,
cleaning parameters, and phase of the moon.
Doug Pauls
"Kane, Joseph E (US SSA)" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
03/16/2010 09:24 AM
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TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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Re: [TN] Eliminating interemediate washes
It may be possible, but I think there are two things to
consider:
1. In the time between soldering and cleaning, does the
older flux harden to the extent that it becomes difficult
to clean?
2. Are the flux types in the sequential steps all
compatible? You don't want to mix water soluble residues
with rosin, for example, because you may end up with a
highly reactive residue that is difficult to remove. Better
to clean off the reactive residues before they become mixed
with something else.
-Joe
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Tuesday, March 16, 2010 10:06 AM
To: [log in to unmask]
Subject: [TN] Eliminating interemediate washes
Dear Technos,
Is it doable to wash a mixed technology board ( SMT + TH) only at the end
of TH?
I mean instead of repeatedly washing (SMT first side-wash, SMT second
side-wash, TH-wash, manual soldering-wash) adopting a one wash strategy
(SMT first side-no wash, SMT second side-no-wash, TH-no wash, manual
soldering-wash). TH might not be done in the same day as SMT, but no later
than next day and boards washed within 3 hours after wave soldering.
Is anybody in the industry doing this?
Pros and cons?
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer T |
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