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March 2010

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Subject:
Re: Component Staking Adhesive
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Thu, 11 Mar 2010 09:04:08 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (73 lines) 
 Hi Greg,
You may find the attached column from Global SMT & Packaging magazine interesting.

 
Werner
Upcoming workshops:
May 21, IPC Int. Conference on Reliability and Quality of Lead-Free Electronics, Frankfurt, Germany,
      “Reliability Issues and Solution Options for Pb-Free Soldered Electronic Products”
May 26, FED Seminar, Stuttgart, Germany,
     “Bleifreie Lötprozesse—Frühausfälle, Qualität, Zuverlässigkeit”
June 8, SMT/HYBRID/PACKAGING 2010, Nürnberg, Germany,
     “Reliability Issues with Lead-Free Soldering”



 

 

-----Original Message-----
From: Gregg Owens <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Mar 11, 2010 12:19 am
Subject: [TN] Component Staking Adhesive


Dear Technetters:

A general survey question as to what type of adhesive you use to stake 
components to survive Aerospace/Space applications?

Thanks in advance.

Gregg Owens
Technical Writer - Avionics
Space Exploration Technologies

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