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March 2010

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Subject:
From:
Mike Fenner <[log in to unmask]>
Reply To:
Date:
Thu, 11 Mar 2010 08:59:59 +0000
Content-Type:
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Yes, with that alloy combo it is possible that your joints will have an
Sn/In intermetallic zone with MP around 118C and Sn/Pb/In at ~120-130C. This
could limit the max service temp of those joints to <<100C (depending on the
number of cycles/mechanical stresses in service etc).
As mentioned by Wayne In can make undesirable intermetallics with Cu, but
presumably this issue was considered when you first determined on the
80In/15Pb/5Ag. 

Regards
 
Mike


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Wednesday, March 10, 2010 10:34 PM
To: [log in to unmask]
Subject: Re: [TN] Low Temp Solder Paste

Hi Carl - as Werner described, using a low temperature paste and a 
solderball that melts at a higher temperature will result in some type of 
metallurgical gradient with different amounts of microstructure/phase 
variation dependent on the actual temperature gradient experienced. The 
specific solder alloys will play a big role as they determine the types of 
phases that will be produced. And with In, Ag, Pb, and Sn in the mix with 
the elemental percentages you described, all sorts of "fun" things could 
happen.  The In/Pb/Ag alloy melts around 150C so you are also going to 
have solder joint integrity issues in many high performance use 
environments. I would anticipate that the 80% In content makes the paste 
cost painful too. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]



Carl Ray <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
03/10/2010 04:06 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Carl Ray <[log in to unmask]>


To
[log in to unmask]
cc

Subject
Re: [TN] Low Temp Solder Paste






Sorry about that Werner (I really wanted you to guess  :) ). The solder is 
80In, 15Pb and 5Ag

________________________________
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Wednesday, March 10, 2010 3:44 PM
To: [log in to unmask]; Carl Ray
Subject: Re: [TN] Low Temp Solder Paste

Hi Carl,
You did not say what the paste is.
When you have a high-melt SnPb ball and 63Sn/37Pb paste you wind up with a 
good solder joint having a gradient in Sn/Pb concentrations.
When you have a SAC ball and 63Sn/37Pb paste, it depends how long you are 
above the Liquidus temperature of the SAC solder and whether you get good 
mixing-while it is not the ideal solution alloy, with good mixing the 
fatigue resistance is comparable to SAC & SnPb.
In you case-well, IT DEPENDS.
Werner



-----Original Message-----
From: Carl Ray <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Mar 10, 2010 4:09 pm
Subject: [TN] Low Temp Solder Paste

Hi Technetters!!! I have a question regarding low temp solder paste and 
standard





63/37 eutectic BGAs. Has anyone had any experience with this type of 
process?





What are the pros and cons? Obviously the BGA doesn't see the temperatures





needed for the balls to collapse so what type of solder joint do you end 
up





with?















Carl Ray





Manufacturing Engineering Manager





Teledyne Electronic Manufacturing Services





1425 Higgs Rd.





Lewisburg, TN 37091





Direct: 931-270-2724





Cell: 931-637-5958





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