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Subject:	Re: pin hole surafce mount joint
From:	Joseph Khiew <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Joseph Khiew <[log in to unmask]>
Date:	Wed, 10 Mar 2010 18:51:28 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (18 lines)

Hi,

We have baking the components and result are positive.
Kindly advise what type of failure analysis needed from the component supplier 
to carry out as to pinpoint the culprit of the problem.

Thanks.

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