Hi Lee-

I don't know why you would want to re-ball.  I initially was concerned about soldering to this alloy with eutectic SnPb, but Tech-Netters convinced me that there was no problem, and indeed there was not!

The high Pb balls act as nice standoffs to keep the joint height up.  Only part which requires imagination is printing solder paste to place them into, and that's only if it's a flipchip.

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Wednesday, March 10, 2010 5:31 PM
To: [log in to unmask]
Subject: Re: [TN] 90Pb / 10Sn SOLDER BALLS

 Hi Lee,
That is about right-for larger BGAs you may have to run the peak reflow zone somewhat hotter-you need to reach 203C for about 5 sec at the solder ball centermost under the BGA.
Werner








-----Original Message-----
From: Lee Whiteman <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Mar 10, 2010 5:14 pm
Subject: [TN] 90Pb / 10Sn SOLDER BALLS


If you had to re-ball a BGA with 90Pb/10Sn non-collapsible solder balls, what
would your peak temperature be? For reflow soldering processing purposes, what
would your peak temperature be?

If it was eutectic SnPb, I would anticipate the peak temperature to be about
215C for re-balling and reflow soldering.

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]


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