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Subject:
From:
Carl Ray <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Carl Ray <[log in to unmask]>
Date:
Wed, 10 Mar 2010 14:06:02 -0800
Content-Type:
text/plain
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text/plain (243 lines)
Sorry about that Werner (I really wanted you to guess  :) ). The solder is 80In, 15Pb and 5Ag

________________________________
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Wednesday, March 10, 2010 3:44 PM
To: [log in to unmask]; Carl Ray
Subject: Re: [TN] Low Temp Solder Paste

Hi Carl,
You did not say what the paste is.
When you have a high-melt SnPb ball and 63Sn/37Pb paste you wind up with a good solder joint having a gradient in Sn/Pb concentrations.
When you have a SAC ball and 63Sn/37Pb paste, it depends how long you are above the Liquidus temperature of the SAC solder and whether you get good mixing-while it is not the ideal solution alloy, with good mixing the fatigue resistance is comparable to SAC & SnPb.
In you case-well, IT DEPENDS.
Werner



-----Original Message-----
From: Carl Ray <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Mar 10, 2010 4:09 pm
Subject: [TN] Low Temp Solder Paste

Hi Technetters!!! I have a question regarding low temp solder paste and standard





63/37 eutectic BGAs. Has anyone had any experience with this type of process?





What are the pros and cons? Obviously the BGA doesn't see the temperatures





needed for the balls to collapse so what type of solder joint do you end up





with?















Carl Ray





Manufacturing Engineering Manager





Teledyne Electronic Manufacturing Services





1425 Higgs Rd.





Lewisburg, TN 37091





Direct: 931-270-2724





Cell: 931-637-5958





Email: [log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>>















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