I agree completely. With a thinner board such as this, localized stresses could 
cause not only intermiitent connections with the contact pins, you could also 
be stressing components and solder joints. 

Blair

On Mon, 8 Mar 2010 09:07:17 -0800, John Burke <[log in to unmask]> 
wrote:

>It depends........8-)
>
>Push down fixtures need to be carefully designed in order to balance the
>localized probe forces. If they are badly designed the results can indeed
>have adverse impacts on reliability.
>
>
>John Burke
>(408) 515 4992
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Gobinathan Athimolom
>Sent: Sunday, March 07, 2010 11:37 PM
>To: [log in to unmask]
>Subject: [TN] PCBA Test
>
>Hello Technet,
>
>
>I'm looking forward your invaluable input concerning ICT test on PCB that
>has thickness of 1.2mm (0.0472") in total. What are the issues that we might
>run into if the PCB (thickness 1.2mm) is subjected to ICT using press down
>fixture instead of vacuum fixture? In term of reliability and repeatability.
>
>
>Thanks,
>
>Gobi
>

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