Hi Technetters!!! I have a question regarding low temp solder paste and standard 63/37 eutectic BGAs. Has anyone had any experience with this type of process? What are the pros and cons? Obviously the BGA doesn't see the temperatures needed for the balls to collapse so what type of solder joint do you end up with?


Carl Ray
Manufacturing Engineering Manager
Teledyne Electronic Manufacturing Services
1425 Higgs Rd.
Lewisburg, TN 37091
Direct: 931-270-2724
Cell: 931-637-5958
Email: [log in to unmask]<mailto:[log in to unmask]>


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