TECHNET Archives

March 2010

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Frank Kriesch <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 17 Mar 2010 13:49:58 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
Ioan,

it depends 

- on the time between application of flux and cleaning
- the type of flux and solderpaste. You have to define the product by 
name, not only by activityclass
- on the type of cleaning system 

Take testboards and do SIR-testing and ionic-testing. 
Think about the various possibilities of processes. Any additional 
solderprocess hardens the flux applied in prior steps. 
Based on the results you can specify the acceptable times between 
application and cleaning.


Regards

Frank

.
Der Inhalt dieser E-Mail ist für den Absender rechtlich nicht verbindlich.
Informieren Sie uns bitte, wenn Sie diese E-Mail fälschlicherweise erhalten haben (Fax: +49-7551-891-4001). Bitte löschen Sie in diesem Fall die Nachricht. Jede Form der weiteren Benutzung ist untersagt.
.
The content of this e-mail is not legally binding upon the sender.
If this e-mail was transmitted to you by error, then please inform us accordingly (Fax: +49-7551-891-4001). In such case you are requested to erase the message. Any use of such e-mail message is strictly prohibited.

______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2