Hi Mel,
The TAEC does not determine anything technical—its function is to approve new committee efforts.
I agree with your assessment—it is a matter of the weakest link giving first. And it is a matter of inadequate resin cohesive strength, for
which we do not as yet have a test method [we are working on a 'Pad Cratering' document IPC-TM-2.6.28, TAEC-approved], any
requirement, or any standard [should be in IPC-4101]
Werner
Upcoming workshops:
May 21, IPC Int. Conference on Reliability and Quality of Lead-Free Electronics, Frankfurt, Germany,
“Reliability Issues and Solution Options for Pb-Free Soldered Electronic Products”
May 26, FED Seminar, Stuttgart, Germany,
“Bleifreie Lötprozesse—Frühausfälle, Qualität, Zuverlässigkeit”
June 8, SMT/HYBRID/PACKAGING 2010, Nürnberg, Germany,
“Reliability Issues with Lead-Free Soldering”
-----Original Message-----
From: Mel Parrish <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Mar 3, 2010 8:48 am
Subject: Re: [IPC-600-6012] Bundle Crack in Microsection
Good Morning!
Would the laminate failure mechanism be significantly different whether
the crack is in the bundle or at the weave intersection (measle) which
IPC TAEC has determined to be acceptable for all classes of product?
Seems that the condition would be the same, and in the case of CAF - the
filament travels along the bundle or within the bundle and even bundle
to bundle along the weave pattern. I seems they are both caused by a
resin adhesion issues.
Mel Parrish
FSO/Director Training Materials Resources
STI Electronics Inc.
261 Palmer Road
Madison, AL 35758
256 705 5530
[log in to unmask]
www.stielectronicsinc.com
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Lance A
Auer
Sent: Tuesday, March 02, 2010 4:38 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Bundle Crack in Microsection
John,
This looks like the type of crack that Phil Henault was lobbying
to get put into IPC-A-600. The crack is within a glass fiber bundle,
not
at the "knuckle". We consider this to be a laminate defect.
Thanks,
Lance
From:
John Perry <[log in to unmask]>
To:
[log in to unmask]
Date:
01/28/2010 05:40 PM
Subject:
[IPC-600-6012] Bundle Crack in Microsection
Sent by:
IPC-600-6012 <[log in to unmask]>
Hi Everyone,
We've got a request for feedback on the anomaly in the attached .ppt
file
which was detected in one bundle of glass in a coupon. This is in the
center of the board stack, which is a 24 layer construction. Since it
is
in the core material it may be related to glass non-wetting of the resin
or poor glass treatment.
I'd also like to know if this is something we can consider developing
criteria for in the next generation of IPC-6012/A-600 when we meet in
Las
Vegas in a couple months.
Regards,
John Perry
Technical Project Manager
IPC - Association Connecting Electronics Industries(r)
3000 Lakeside Drive # 309S
Bannockburn, IL 60015-1249 USA
+1 847-597-2818 (tel)
+1 847-615-7105 (fax)
+1 847-615-7100 (Main)
[log in to unmask]
www.ipc.org
[attachment "Bundle crack.ppt" deleted by Lance A Auer/US/Raytheon]
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