Hi Bob,
Sure did.
The difference is a rigid pin soldered down in a butt joint vs. a soft forgiving (somewhat in SAC's case) solder ball that behaves very differently.
Werner
-----Original Message-----
From: Bob Landman <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Werner Engelmaier <[log in to unmask]>
Cc: [log in to unmask] <[log in to unmask]>
Sent: Wed, Mar 24, 2010 7:33 am
Subject: Re: [TN] TI/Emerson SMT Board Mounted Power
Werner,
Why would the Autosplice technique (which is apparently what TI uses) behave any different than a large BGA thermally? Have you looked at the animation drawing in the Autosplice datasheet?
Bob
Sent from my iPhone
On Mar 23, 2010, at 4:47 PM, Werner Engelmaier <[log in to unmask]> wrote:
> If they were flexible that would workâbut the picture sure does not > make them look flexible.
> Werner
>
>
>
>
>
>
>
>
> -----Original Message-----
> From: Thayer, Wayne - IIW <[log in to unmask]>
> To: [log in to unmask]
> Sent: Tue, Mar 23, 2010 4:34 pm
> Subject: Re: [TN] TI/Emerson SMT Board Mounted Power
>
>
> But Werner, what if the legs are very malleable? Won't it be more > like a CGA
> then? (Of course, if they were that flexible, the package would > probably need
> another technique to support its body.)
>
> Wayne Thayer
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
> Sent: Tuesday, March 23, 2010 3:30 PM
> To: [log in to unmask]
> Subject: Re: [TN] TI/Emerson SMT Board Mounted Power
>
> Hi Bob & Graham,
> Be very careful using these-this is a pin grid array with butt-> joints in
> disguise.
> It will work if you have not much of a thermal expansion mismatch > between
> component and PCB, but if you do you will get very early solder > joint failures.
> Werner
>
>
>
>
>
>
>
>
> -----Original Message-----
> From: Bob Landman <[log in to unmask]>
> To: [log in to unmask]
> Sent: Tue, Mar 23, 2010 2:42 pm
> Subject: Re: [TN] TI/Emerson SMT Board Mounted Power
>
>
> Graham,
>
> While I have not tried this clever device, it seems like a good way > to solve the
> problem.
>
> See http://www.autosplice.com/solderball-pins/
>
> "Eliminates Coplanarity Concerns When Soldering Parallel PC Boards
>
> Packaged in Tape Reel for use with standard feeders for automated > placement. The
> product contains a Solderball that maintains its shape during > multiple solder
> reflow processes. The PC board or device can then easily be soldered > to pads on
> another parallel PC board. The Solderball pins accommodate up to .> 020" (0.5mm)
> coplanarity variation with high current reliability."
>
> Bob Landman
> H&L Instruments, LLC
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins
> Sent: Tuesday, March 23, 2010 8:45 AM
> To: [log in to unmask]
> Subject: Re: [TN] TI/Emerson SMT Board Mounted Power
>
> Hi Russell
> Is it skewed before it goes into the reflow oven? If yes, then a > placement
> issue. If it looks OK before reflow oven and is skewed after the > reflow oven
> then obviously is moving in there - which points to a pad size > problem.
>
> If their placement is good and it is skewing in the oven, one trick > we have used
> in the past is to dispense a glue dot under the component body
> - it will hold the alignment during reflow. We have used this > method when pad
> layout is not quite right and the alignment is critical to meet IPC-> A-610
> requirements (e.g. for heel fillet). They would need to have glue > dispense
> capability though.
>
> regards,
> - Graham
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Nowland, Russell > Howard
> (Russell)
> Sent: Monday, March 22, 2010 4:57 PM
> To: [log in to unmask]
> Subject: [TN] TI/Emerson SMT Board Mounted Power
>
> Hello Technetters,
>
> I have a problem I hope someone out there has a solution for.
>
> I have on a PCA that uses a Texas Instrument/(Emerson Power/Artesyn) > (dual
> sourced but part of the POLA) SMT board mounted power converter.
> The MPN is PTH03050WAS. It is actually combination PTH and SMT. > The device has
> 40 mil diameter pins for PTH and to make it SMT they simply add a > donut (solder
> dam) on the pin and round the edges and call it a solder ball. I > think the
> problem my EMS is having is really with pick-n-place because the > pick-up point
> (Actually the top of a
> transformer) is off-center, fairly small, and it has a plastic label > on it.
>
> The problem is the device is coming out of the oven skewed and > violating IPC
> 610D. The pad diameter is exactly what is recommended by the > datasheet
> (.085-inches). The TI datasheet recommended a 0.080-0.085 diameter > aperture @
> six mils. Originally my EMS had 0.085-inch @ 5 mils but changed the > aperture to
> a bull's-eye shape with the thought the bull's-eye would help center > the device.
> Both of the stencils have failed to draw the device to the center.
>
> Because this is really a Butt Joint I am holding the EMS to no side > overhang.
> This is causing them quite a headache. They have also not come up > with a viable
> solution either.
>
> Here is the link to the data sheet
>
> http://www.emerson.com/sites/network_power/en-US/Products/Product_Detail
> /Product1/Documents/PTH03050%20DC-DC%20Converter/PTH03050%20Data> %20Sheet
> .pdf
>
>
>
> Has anybody used these devices with good results? If so can you > share your
> methodology?
>
> Thanks in advanced,
>
>
> Russell Nowland
> Alcatel-Lucent
> Advanced Manufacturing Engineer
> Address: 14000 Quail Spring Parkway, Suite 300 Oklahoma City, OK 73134
> email:
> [log in to unmask]<mailto:russell.nowland@alcatel-> lucent
> .com>
> Desk: 405-302-1660
> Cell: 405-203-0034
> Fax: 405-302-1622
>
>
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