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Date: | Wed, 10 Mar 2010 17:31:19 -0500 |
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Hi Lee,
That is about right—for larger BGAs you may have to run the peak reflow zone somewhat hotter—you need to reach 203C for about 5 sec at the solder ball centermost under the BGA.
Werner
-----Original Message-----
From: Lee Whiteman <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Mar 10, 2010 5:14 pm
Subject: [TN] 90Pb / 10Sn SOLDER BALLS
If you had to re-ball a BGA with 90Pb/10Sn non-collapsible solder balls, what
would your peak temperature be? For reflow soldering processing purposes, what
would your peak temperature be?
If it was eutectic SnPb, I would anticipate the peak temperature to be about
215C for re-balling and reflow soldering.
Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
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