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March 2010

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TechNet <[log in to unmask]>
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[log in to unmask], Paul Edwards <[log in to unmask]>
Date:
Wed, 10 Mar 2010 18:51:28 -0600
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Joseph Khiew <[log in to unmask]>
Subject:
Re: pin hole surafce mount joint
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From:
Joseph Khiew <[log in to unmask]>
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Hi,

We have baking the components and result are positive.
Kindly advise what type of failure analysis needed from the component supplier 
to carry out as to pinpoint the culprit of the problem.

Thanks.

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