Good Morning!
Would the laminate failure mechanism be significantly different whether
the crack is in the bundle or at the weave intersection (measle) which
IPC TAEC has determined to be acceptable for all classes of product?
Seems that the condition would be the same, and in the case of CAF - the
filament travels along the bundle or within the bundle and even bundle
to bundle along the weave pattern. I seems they are both caused by a
resin adhesion issues.


Mel Parrish
FSO/Director Training Materials Resources
STI Electronics Inc.
261 Palmer Road
Madison, AL 35758
256 705 5530
[log in to unmask]
www.stielectronicsinc.com

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Lance A
Auer
Sent: Tuesday, March 02, 2010 4:38 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Bundle Crack in Microsection

John,

        This looks like the type of crack that Phil Henault was lobbying

to get put into IPC-A-600.   The crack is within a glass fiber bundle,
not 
at the "knuckle".   We consider this to be a laminate defect.

Thanks,
Lance





From:
John Perry <[log in to unmask]>
To:
[log in to unmask]
Date:
01/28/2010 05:40 PM
Subject:
[IPC-600-6012] Bundle Crack in Microsection
Sent by:
IPC-600-6012 <[log in to unmask]>



Hi Everyone,

We've got a request for feedback on the anomaly in the attached .ppt
file 
which was detected in one bundle of glass in a coupon.  This is in the 
center of the board stack, which is a 24 layer construction.  Since it
is 
in the core material it may be related to glass non-wetting of the resin

or poor glass treatment.

I'd also like to know if this is something we can consider developing 
criteria for in the next generation of IPC-6012/A-600 when we meet in
Las 
Vegas in a couple months.

Regards,

John Perry
Technical Project Manager
IPC - Association Connecting Electronics Industries(r)
3000 Lakeside Drive # 309S
Bannockburn, IL 60015-1249 USA
+1 847-597-2818 (tel)
+1 847-615-7105 (fax)
+1 847-615-7100 (Main)
[log in to unmask]
www.ipc.org


[attachment "Bundle crack.ppt" deleted by Lance A Auer/US/Raytheon] 


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