J-STD-001DS specifically does not allow ANY gold on areas to be
soldered, except for ENIG on circuit boards, and ENIG only as defined
per IPC 4552.
Objective evidence is also not considered to be immediate pull or peel
test readings, because gold embrittlement is a time-variable phenomena.
Gold cups have been proven to be especially susceptible to brittle
fractures from gold nucleation over time. I had to deal with that when
several wires broke from vibration inside of torpedoes, so I know they
are especially vulnerable. The gold content in the solder was proven to
be less than 2%.
I am sure Werner will weigh in on this as well.
R. Dean Stadem
Consulting Engineer
Analog Technologies Corp./Lumagine, Inc.
11441 Rupp Drive
Burnsville, MN 55431
(952)894-9228
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave He
Sent: Thursday, February 04, 2010 5:54 PM
To: [log in to unmask]
Subject: Re: [TN] Tinning gold-plated solder cup of connectors
Great, Bob. This is what I am looking for. Two Qs
1. The amendment is for J-STD-001 DS, will it cover J-STD-001?
2. Does " Surfaces exhibiting gold finish thicknesses of 0.254
micro-meters
(10 micro-inch) or less (a.k.a. ''gold-flash'') are exempt from this
requirement." cover SMT component? I guess so but it not clearly stated.
Thanks.
Regards,
Dave He
Ext: 333
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Landman
Sent: Thursday, February 04, 2010 2:34 PM
To: [log in to unmask]
Subject: Re: [TN] Tinning gold-plated solder cup of connectors
Gold flash is also exempt according to the amendment #1 of J-STD-001DS -
isn't the SAMTEC part gold flash?
http://www.ipc.org/4.0_Knowledge/4.1_Standards/J-STD-001DS-Amend1.pdf
3.9.3 Gold Removal Gold shall be removed from at least 95% of the
surface
to-be-soldered of all component leads,
component terminations, and solder terminals. A double tinning process
or
dynamic solder wave may be used for
gold removal.
Exceptions:
Electroless nickel immersion gold (ENIG) finishes on PCBs are exempt
from
this requirement.
Surfaces exhibiting gold finish thicknesses of 0.254 micro-meters (10
micro-inch) or less (a.k.a. ''gold-flash'') are
exempt from this requirement.
These requirements may be eliminated if there is objective evidence
approved
by the user prior to use that there are
no gold related solder embrittlement problems associated with the
soldering
process being used.
Bob Landman
H&L Instruments, LLC
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gregg Owens
Sent: Thursday, February 04, 2010 5:16 PM
To: [log in to unmask]
Subject: Re: [TN] Tinning gold-plated solder cup of connectors
Dear Dave:
J-STD-001's only exception to gold tinning is ENIG plated PCBs. Also it
provides that the entire requirement be ignored if you have data to
support
that no gold embrittlement issues exist without pre-tinning.
Gregg Owens
Technical Writer - Avionics
Space Exploration Technologies Corporation
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave He
Sent: Thursday, February 04, 2010 12:19 PM
To: [log in to unmask]
Subject: [TN] Tinning gold-plated solder cup of connectors
Does gold plated solder cup of connector need tinning per J-STD-001? Or
is
this a exemption? Thanks.
Best regards,
Dave He
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