Gold flash is also exempt according to the amendment #1 of J-STD-001DS - isn't the SAMTEC part gold flash?

http://www.ipc.org/4.0_Knowledge/4.1_Standards/J-STD-001DS-Amend1.pdf

3.9.3 Gold Removal Gold shall be removed from at least 95% of the surface to-be-soldered of all component leads,
component terminations, and solder terminals. A double tinning process or dynamic solder wave may be used for
gold removal.

Exceptions:

Electroless nickel immersion gold (ENIG) finishes on PCBs are exempt from this requirement.
Surfaces exhibiting gold finish thicknesses of 0.254 micro-meters (10 micro-inch) or less (a.k.a. ‘‘gold-flash’’) are
exempt from this requirement.

These requirements may be eliminated if there is objective evidence approved by the user prior to use that there are
no gold related solder embrittlement problems associated with the soldering process being used.

Bob Landman
H&L Instruments, LLC 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gregg Owens
Sent: Thursday, February 04, 2010 5:16 PM
To: [log in to unmask]
Subject: Re: [TN] Tinning gold-plated solder cup of connectors

Dear Dave:

J-STD-001's only exception to gold tinning is ENIG plated PCBs. Also it provides that the entire requirement be ignored if you have data to support that no gold embrittlement issues exist without pre-tinning. 

Gregg Owens
Technical Writer - Avionics
Space Exploration Technologies Corporation

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave He
Sent: Thursday, February 04, 2010 12:19 PM
To: [log in to unmask]
Subject: [TN] Tinning gold-plated solder cup of connectors

Does gold plated solder cup of connector need tinning per J-STD-001? Or is this a exemption? Thanks.

 

Best regards,

 

Dave He

 

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