Dave,
Seems like a beautiful idea (the way Richard just described it), if I understand what he's saying. By tilting the machine does the same thing that they do in radiation therapy for cancer; limit the exposure to the intervening substrate by constantly moving the part, focusing all the IR energy on the solder ball.
MIL customers need SnPb solder balls on their parts and the manufacturers have refused to provide them with balless packages. I assume this laser process removes the balls and eliminates damaging thermal cycles?
Quite a few PERM members would be interested in this technique if it's as it seems from the article Richard posted, a vastly superior way to reball parts.
Bob Landman
H&L Instruments, LLC
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Wednesday, February 03, 2010 5:31 PM
To: [log in to unmask]
Subject: Re: [TN] Laser soldering of BGA
Hi John - given that a wide variety of materials make up a component construction, isn't there a fairly high risk of damaging a component if you transmit the laser heat thru the package?
Dave Hillman
Rockwell Collins
[log in to unmask]
John Burke <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
02/03/2010 04:21 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to John Burke <[log in to unmask]>
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Subject
Re: [TN] Laser soldering of BGA
Yes actually I have used it many times.
The transmission is through the package from the top of the device (don?t
try it with a heat spreader or metal lid!) and the laser is set up to scan
up and down the ball pattern on the board continuously.
Since the transmission of the selected frequency (usually prime frquency
YAG) is at 1.06somthing micron wavelength, the thermal uptake of the
package
is from mempory about 20% the rest being concentrated in the joints.
There are a number of machines available for doing this but very expensive
and usually for re-work not for placement.
Of course you could reflow that part from the other side of the substrate
using the same technique, but I have a question which is:
Why not use a "normal" reflow syatem"??
John Burke
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: Wednesday, February 03, 2010 2:07 PM
To: [log in to unmask]
Subject: Re: [TN] Laser soldering of BGA
OK, I've played with using a laser for soldering, but could you share how
the laser light manages to get to the ball beneath a BGA?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Wednesday, February 03, 2010 4:53 PM
To: [log in to unmask]
Subject: Re: [TN] Laser soldering of BGA
Hi Ioan,
What I know about laser soldering would not fit on the back of a postage
stamp but as far as the BGA and flex if the stiffener is FR-4 I suspect
you
will have to underfill unless it is in a very benign environment -
otherwise
use a metal stiffener.
Regards Steve Kelly
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: February-03-10 2:35 PM
To: [log in to unmask]
Subject: [TN] Laser soldering of BGA
Dear Technos,
Any insights on BGA laser soldering? It is for soldering a 15x15 mm BGA
onto
a flex PCB. The flex is backed by a rigid substrate in the BGA zone, but
due
to mechanical constraints this substrate cannot be thicker than 0.012".
Oh yes, lead-free.
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer T |
450.967.7100 ext.244 E | [log in to unmask] <mailto:[log in to unmask]> W |
www.digico.cc <http://www.digico.cc/>
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