Hi Ioan,
What I know about laser soldering would not fit on the back of a postage
stamp but as far as the BGA and flex if the stiffener is FR-4 I suspect you
will have to underfill unless it is in a very benign environment - otherwise
use a metal stiffener. 
Regards Steve Kelly

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: February-03-10 2:35 PM
To: [log in to unmask]
Subject: [TN] Laser soldering of BGA

Dear Technos,

 

Any insights on BGA laser soldering? It is for soldering a 15x15 mm BGA onto
a flex PCB. The flex is backed by a rigid substrate in the BGA zone, but due
to mechanical constraints this substrate cannot be thicker than 0.012". 

 

Oh yes, lead-free.

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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