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Date: | Wed, 3 Feb 2010 09:12:34 -0500 |
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Hi Brian,
I would appreciate pictures, possibly also to Steve, that I could use in my reliability column—this is a failure mode fairly new and unknown to most people.
If you could, I also would appreciate the base material, the peak reflow temperature, the cooling rate after reflow, the Cu trace thickness and whether it was covered with solder, and what solder. I now, its asking a lot, but only with all the pertinent info can we make sense of this.
Werner
-----Original Message-----
From: Brian Chandler <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Feb 3, 2010 7:28 am
Subject: Re: [TN] track lifting
We just conducted a study on acceptable strain levels for lead free products.
Our BGA test coupons showed this exact result from excess strain.
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