I've seen this on post stress samples.

Vic.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Tuesday, February 02, 2010 5:11 PM
To: [log in to unmask]
Subject: Re: [TN] track lifting

Hi Pearl,

Here's your picture:

http://stevezeva.homestead.com/files/Track_Lifting.JPG

What I see in the picture is that BGA (it is a BGA isn't it?) was almost
ripped-off the board somehow. 

The traces are stretched and the soldermask has been torn up from the board.
The root cause is that something mechanically hit the BGA and ripped up pads
and traces. Is there any other marks on the BGA?

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of pearl petras
Sent: Tuesday, February 02, 2010 5:13 PM
To: [log in to unmask]
Subject: [TN] track lifting

While we wait for IPC to set up a picture site, could I impose on Steve to
post another picture?
Any comments as to what could possibly be the root causes of this is much
appreciated.  

Thanks so much


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