Hi All,
Arnaud asked for the reference on the HP document mandating cooling rates not to exceed 1.5°C/sec.
Turns out, I do not have it. HELP—does anybody have it handy?
Werner

 


 

 

-----Original Message-----
From: Arnaud Grivon <[log in to unmask]>
To: Werner Engelmaier <[log in to unmask]>
Sent: Wed, Feb 3, 2010 3:36 am
Subject: Re: [LF] Cooling rates


Hello Werner, 
 
Fully agree with your warning! 
I have had some similar discussions on several opportunities... 
I would be very interested if you could send me the HP document setting the mentioned requirement of 1.5°C/sec. maximum cooling rate. At least, the document reference and the paragraph inquestion. 
Even if I am not in the same industry, problems seen in the consumer market mostly end up in high-end applications (see head-in-pillow on which HP sent several warnings). 
Best regards, 
 
Arnaud Grivon 
 
Werner Engelmaier a écrit : 
>  > 
> That has no benefit for solder joint reliability and sets up large T-gradients > causing problems with thermal expansion mismatches. 
> Everybody (!) check your cooling rates—H-P has mandated no more than 1.5°C/sec > for good reason. 
> Werner 
> 
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Arnaud Grivon 
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